JPH0188879U - - Google Patents
Info
- Publication number
- JPH0188879U JPH0188879U JP18471187U JP18471187U JPH0188879U JP H0188879 U JPH0188879 U JP H0188879U JP 18471187 U JP18471187 U JP 18471187U JP 18471187 U JP18471187 U JP 18471187U JP H0188879 U JPH0188879 U JP H0188879U
- Authority
- JP
- Japan
- Prior art keywords
- bag
- moisture
- less
- semiconductor device
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471187U JPH0188879U (en]) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471187U JPH0188879U (en]) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0188879U true JPH0188879U (en]) | 1989-06-12 |
Family
ID=31476052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18471187U Pending JPH0188879U (en]) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0188879U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021002601A (ja) * | 2019-06-21 | 2021-01-07 | パナソニックＩｐマネジメント株式会社 | 部品テープ管理装置、部品テープ管理システム、および部品テープ管理方法 |
| WO2025083922A1 (ja) * | 2023-10-19 | 2025-04-24 | 信越ポリマー株式会社 | 物品の梱包袋及び梱包方法 |
-
1987
- 1987-12-02 JP JP18471187U patent/JPH0188879U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021002601A (ja) * | 2019-06-21 | 2021-01-07 | パナソニックＩｐマネジメント株式会社 | 部品テープ管理装置、部品テープ管理システム、および部品テープ管理方法 |
| WO2025083922A1 (ja) * | 2023-10-19 | 2025-04-24 | 信越ポリマー株式会社 | 物品の梱包袋及び梱包方法 |
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